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Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
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Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
  • Volume / Net Weight: 3.5g
  • Long Term Operating Temperature: -30~150
  • Features: GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
  • Model #: GC-4-3.5g
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  • $50.99 
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COOLER MASTER MGZ-NDSG-N15M-R1 Master Gel Maker Nano, Born for Makers
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COOLER MASTER MGZ-NDSG-N15M-R1 Master Gel Maker Nano, Born for Makers
  • Volume / Net Weight: 4.0g
  • Thermal Conductivity: 11.0 W/mK
  • Model #: MGZ-NDSG-N15M-R1
COOLERMASTER MGZ-NDSG-N15M-R2 New Edition MasterGel Maker
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COOLERMASTER MGZ-NDSG-N15M-R2 New Edition MasterGel Maker
  • Volume / Net Weight: 1.5 ml
  • Thermal Conductivity: 11 W/m-K
  • Specifications: • Ultra-high CPU/GPU conductivity (11 W/m-K) • NanoDiamond particles maintains through a wide range of temperatures​ • ​Excellent viscosity makes it easy to spread or remove without cracking or drying out • Enhanced User Experience Design • Precise and Even • Easy to spread and remove without surface damage •
  • Features: • Introducing the 2019 New Edition MasterGel Series, with Cooler Master's new exclusive flat-nozzle syringe design which enhances the user experience by making the application process as simple as possible. This new design eliminates the process of having to use a scrapper and mess that comes with applying thermal grease.
  • Model #: MGZ-NDSG-N15M-R2
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