AMD's Zen architecture was a milestone in CPU architecture and a stroke of genius for the Texas chip maker. But instead of resting on its laurels, AMD has continued to develop the "Zen" processors. With the "Ryzen 3000" processor family based on the "Zen2" architecture, AMD hasintroducedachiplet design, for example. For example, the Ryzen 9 3900X consists of a 12 nm I / O die and two CPU dies that are manufactured in a 7 nm process.
Due to this chiplet design, however, the layout of the CPU dies on the package has also changed, which also shifts thethermal center
Has. For a processor with only one CPU die under the heat spreader, the "hot spot" is in the middle of the CPU. Due to the chiplet design, the "hot spot" moves to the edge of the processor.
Of course, this also has an impact on the cooling behavior of CPU coolers. Especially all-in-one water coolers with a round cooling block often do not completely cover the corners of the heat spreader. For optimal cooling performance, the base plate of the AiO water cooler would have to be moved.
This is where professional overclocker Roman Hartung comes in to use the der8auer RYZEN 3000 OC AIO mounting frame to flexibly design the position of the base plate of the AIO water cooling on the processor. The der8auer RYZEN 3000 OC AIO mounting frame at a glance