All-round heat dissipation: surrounded by aluminum on all sides, strong heat dissipation while suppressing EMI, reducing interference to high-speed signals.
Two-way design and smooth wind: Innovative variable direction air duct design, which can be installed in compliance with the air duct of the chassis, so that heat dissipation is smooth.
8 ventilation holes, PWM4 PIN adjustable speed fan can be directly connected to the motherboard fan interface, more than 400 recesses inside and outside the groove, doubled the heat dissipation area, and the heat dissipation is more powerful.
Using high-conductivity heat dissipation silicon chip, can be used repeatedly.
Note: After installation, the upper side will be increased by about 8mm; the two sides will be widened by about 1mm, please confirm whether the space of the case is sufficient before purchasing; due to the insufficient length of the heat sink, the 22x110mm SSD cannot be fully covered.