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2pcs/set 5g White Conductive Heatsink Plaster Thermal Silicone Adhesive Cooling Paste For PC Computer Heat Sink Sticky Hot Sale
- Good Quality
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Overview
Specs
Reviews
2pcs STARS-922 Heatsink Plaster Thermal Silicone Adhesive Cooling Paste Strong Adhesive Compound Glue
Features:
1. It has good conductivity and wide service temperature range(-60~200), short term 300 high temperature.
2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free.
3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.
Specifications:
Weight: approx. 10g
Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge etc.
Hot melt adhesive type: other
Shear strength: 1.5 (MPa)
Active use period: 10 (min)
Shelf life: 12 (months)
Solidification time: 3min 25°C
Color: White
Thermal conductivity: >0.671W/m.k
Surface curing time: 10MIN/25
Operation Manual:
1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again.
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4. Before use, please clean with solvent (such as alcohol) adhesive surface, detergents should be surface to be clean before painting.
Note:
Features:
1. It has good conductivity and wide service temperature range(-60~200), short term 300 high temperature.
2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free.
3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.
Specifications:
Weight: approx. 10g
Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge etc.
Hot melt adhesive type: other
Shear strength: 1.5 (MPa)
Active use period: 10 (min)
Shelf life: 12 (months)
Solidification time: 3min 25°C
Color: White
Thermal conductivity: >0.671W/m.k
Surface curing time: 10MIN/25
Operation Manual:
1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again.
2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4. Before use, please clean with solvent (such as alcohol) adhesive surface, detergents should be surface to be clean before painting.
Note:
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 15 days
- Return for replacement within: 30 days
- This item is covered by Hetai Return Policy
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