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    Processor Thermal Conductive Paste Grease PC Heat-sink Cooling Cream New Arrival

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    Processor Thermal Conductive Paste Grease PC Heat-sink Cooling Cream New Arrival

    Description:

    Feature:

    It is 1g Gold thermal compound which has with 3.8W/mK a very high thermal conductivity and is therefore good for nearly all cooling applications.

    The compound will be delivered in a Syringe and can be easily used for dispensing the Paste in thin layers between Processor and Heat Sink and normally is sufficient for 3 - 10 uses.

    Specification:

    Thermal Conductivity: > 3.8 W/m*K

    Thermal Impedance: < 0.087 degC- in²/W

    Specific Gravity: > 2.5

    Thixotropic Index: 380 +/-10  

    Working Temperature: -50 -340degC

    Package Includes:

    1 x Thermal Conductive Grease

    Warranty & Returns

    Warranty, Returns, And Additional Information

    Warranty

    • Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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    Return Policies

    • Return for refund within: 15 days
    • Return for replacement within: 30 days
    • This item is covered by Hetai Return Policy

    Manufacturer Contact Info

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